Solder paste HERAEUS

No-Clean Solder Paste for Dispensing

Description

LPL16933/95 is a ready-to-use homogeneous mixture, consisting of metal powder, binder, solvent, flux and thixotropic agent. Although this paste is optimized for dispensing application, it has a very low slump. LPL16933/95 provides a very good wettability and leaves clear flux residues. It does not contain any halogen or halogenated activators. LPL16901/94 (the same paste just with c. 90 % metal) has passed all tests for no clean solder pastes according to Siemens-standard SN 59650 (issue July 1994). Due to its limited tack time this solder paste is suitable only for the in-line production.