Solder paste KESTER

Kester Easy Profile EP256 No-Clean Electronics Grade Solder Paste

Kester EP 256 is a paste solder developed for high volume SMT reflow soldering. It is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling. EP256 has the widest possible reflow processing window.

Residues that remain after soldering are almost colorless, leaving a cosmetically appealing repair. The residue has high electrical resistance and is safe to be left on the assembly after soldering.

HydroMark 531 Water-Soluble Solder Paste

Product Description

Kester HydroMark 531 is an organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, HM531 provides hours of stable stencil life, tack time and repeatable brick definition. HM531’s robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the HM531 is very aggressive and provides superior wetting to OSP-coated PCB’s and Ag/Pd components.