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Products / Forming, assembling and soldering components / Vapour Phase Oven /
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The Vapor Phase - Reflow - System is a perfect and easy to handle unit for lead and lead free solder-paste to soldering complex SMT components like QFP, BGA, flip chip and as well ceramic assemblies can be soldered in highest quality. Through the small footprint construction you will find easy a place for this unit. To set up the unit you need only a 380V connection.



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