TSF-6592 (Code: )

Kester TSF-6592 is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux.

Performance Characteristics:
-  Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu, SnAgBi

-  Reflow-able with peak temperatures up to  270 °C

-  Reflow-able in air and nitrogen

-  Bright shiny soldered joints with clear residues

-  Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG

-  Clear non-tacky residues

-  High tack to minimize skewing of components

-  Low voiding

-  Stencil Life of 8+ hours (process dependent)

-  Classified as ROL0 per J-STD-004

-  Compliant to Bellcore GR-78

Weight(g):10, 30, 50