Webdesign
Materials for the production of printed circuit boards (PETERS)
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SL1331N - a unicomponent sheeting on the basis of polyurethane pitch. It is applied to protection of assembled printed-circuit boards against influence of environment, salt fog, acids, alkalis and solvents.
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The protective varnish of SL 1309 N-FLZ is intended for processing of the mounted printed-circuit boards which operation is carried out in the conditions of tropics. Along with the increased moisture-proofness, the varnish covering possesses the fungicide properties providing long service life of products.
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particularly distinguished by their high hardness and mechanical strength
high yellowing resistance, thus particularly suited for application in optoelectronics
the smooth white surface lends the cast object a particularly high-grade appearance
VU 4490/31 K: owing to the accelerated curing (Index K = catalysed) processing possible only in mixing and dispensing units
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- solvent-free 1-pack systems - short processing times in spite of high layers owing to optimally synchronised curing mechanisms: fast UV curing and chemical cross-linking reaction in shadow areas
TWIN-CURE DSL 1707 FLZ
- base: silicone (SR) - application: dispensing, brushing, selective coating - micro-encapsulation of small components possible -operating temperature range -65 up to 200 °C
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Peelable Solder Mask
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection in (lead-free) soldering processes like wave soldering, reflow soldering or hot-air solder leveling (HASL).
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- suitable for all common application processes - aqueous-alkaline developable - fulfil/exceed among others IPC-SM-840E, NASA outgassing test acc. to ASTM E595 - mould resistant - resistant against noxious gases - many types available as halogen-free adjustments acc. to JPCA-ES01-2003 / IEC 61249-2-21
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Company Peters is a special composition of solvents containing FP 507-0720, which removes residue-free photosensitive solder mask with defective PCBs. Thus, a series of masks ELPEMER 2463, 2467 and 2469 can be easily removed after application and defective operation of the platen.
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