EPO-TEK H20S (Code: )

Product Description:
EPO-TEK  H20S is a modified version of EPO-TEK H20E, designed primarily for die stamping and dispensing techniques for chip bonding.  EPO-TEK H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency.  In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK H20S is extremely simple to use.

EPO-TEK H20S Advantages & Application Notes:
- Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable.
- Suggested for JEDEC Level III and II plastic IC packaging.
- The low temperature cure makes it ideal for flex circuitry and other low stress applications.
- It is used extensively for bonding quartz crystal oscillators and other stress sensitive chips.
- Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and TO-Cans; also EMI/Rf shielding of micro-electronics.
- Ideal for making ITO electrical contacts in LCD packaging; and suggested for LED die-attach.

Typical Properties: (To be used as a guide only, not as a specification.  Data below is not guaranteed.  Different batches, conditions and applications yield differing results; Cure condition: 150°C/1 hour;  * denotes test on lot acceptance basis)

Physical Properties: