HERAEUS PC 3200 (Code: )

PC 3200 – the thermocured unicomponent conducting glue on an epoxy basis with a silver filler, free from solvents, developed for installation of the superficial mounted components on usual, ceramic payments and for hybrid assembly. Glue incorporates the substance promoting increase in hardness of metal which contains a cation-active hardener.

Particular advantages of glue of the PC 3200 series:
- fast otverzhdeniye
- excellent adhesion
- high the electro - and heat conductivity
- very low content of gas
- it is used as well for the lead-free soldering

Application:
- before use of glue be convinced that substrates and cliches are cleared and dried up
- be convinced that glue got warm to room temperature before opening packing to avoid formation of condensate
- the recommended surfaces: Ni/Au and Ag
- when putting glue by a dispenserny method, all adjoining equipment, such as needles, cartridges and the dosed devices, has to be cleared of other types of glue applied earlier.
- at a glue otverzhdeniye in the furnace, it isn't allowed to use at pollution by organic compounds (amine) or when using in the nitric environment. It isn't allowed to use glue together with other types of glue containing organic compounds.