Forced air convection reflow oven Model:BS3010
- Full hot air convection
- 3 Zone control
- PCB width up to 265mm
- Glass Top Design
- Bench-top unit
- Detachable thermocouple
Product Information
(AutoTronik) BS3010 is a slim size bench-top designed full hot air convection reflow soldering System with microprocessor control which can handle boards up to 265mm width With less than +/-2centigrade degree temperatures gradient.
Glass top Design
Glass top viewing panel allows visual inspection of reflow process.
Bench-top unit
Bench-top unit can be converted to a standalone unit by use of the optional cabinet
Real time temperatures measuring
Detachable thermocouple for measuring substrate temperatures at real time
Microprocessor control
Three heating zones are control by microprocessor with less than +/-2centigrade degree Temperature gradient
Forced air convection reflow oven Modell:BS3010(specifications)
• No shadowing • No hot spots • No cold solder joints • No colour sensitivity • No belt load sensitivity
• Full hot air convection • Full visual inspection • Full microprocessor control • Full environment friendly • Full user satisfaction
Process chamber
|
860mm
|
Soldering width
|
265mm |
Clearance for assemblies
|
25mm |
Transport system
|
Stainless steel spring wires conveyor belt
|
Conveyor speed
|
10-60cm/min
|
Soldering temperatures
|
180-260centigrade degree |
Temperature accuracy
|
+/-2centigrade degree
|
Number of zones
|
3 |
Heatup time
|
15min
|
System control
|
Microprocessor
|
Power
|
208/240V.AC
|
Rated power max
|
3650 Watts
|
Dimensions
|
L X W X H (1540 X 600 X 360)mm
|
Net weight
|
60kg
|
Option
|
Cabinet
|