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Reflow Oven BS3010 (Code: )

Reflow Oven BS3010

Forced air convection reflow oven Model:BS3010

-  Full hot air convection  
-  3 Zone control  
-  PCB width up to 265mm  
-  Glass Top Design  
-  Bench-top unit  
-  Detachable thermocouple

Product Information

(AutoTronik) BS3010 is a slim size bench-top designed full hot air convection reflow soldering System with microprocessor control which can handle boards up to 265mm width With less than +/-2centigrade degree temperatures gradient.

Glass top Design
Glass top viewing panel allows visual inspection of reflow process.

Bench-top unit
Bench-top unit can be converted to a standalone unit by use of the optional cabinet

Real time temperatures measuring
Detachable thermocouple for measuring substrate temperatures at real time

Microprocessor control
Three heating zones are control by microprocessor with less than +/-2centigrade degree Temperature gradient

Forced air convection reflow oven Modell:BS3010(specifications)

•  No shadowing  •  No hot spots  •  No cold solder joints  •  No colour sensitivity  •  No belt load sensitivity

•  Full hot air convection  •  Full visual inspection  •  Full microprocessor control •  Full environment friendly •  Full user satisfaction

 

Process chamber
860mm
Soldering width
265mm
Clearance for assemblies      
25mm
Transport system 
Stainless steel spring wires conveyor belt
Conveyor speed 
10-60cm/min
Soldering temperatures
180-260centigrade degree
Temperature accuracy 
+/-2centigrade degree
Number of zones
3
Heatup time 
15min
System control 
Microprocessor
Power 
208/240V.AC
Rated power max
3650 Watts 
Dimensions 
L X W X H (1540 X 600 X 360)mm
Net weight
60kg
Option 
Cabinet


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