EFD SolderPlus SN62NCLR-A (Code: )

Solder paste SolderPlus SN62NCLR-A is a no-clean solder paste, having optimal performance in any application method:
- A small amount of flux residues after soldering;
- High wettability;
- Lifetime after application: + 8 hours.
NCLR flux residue on the board is colorless, transparent, nelipok, non-corrosive, does not require cleaning. Fluxes and solder pastes of EFD comply with the following international standards:
- J-STD-004 for flux
- J-STD-005 for solder pastes
- J-STD-006A for metal alloy.

Parameters preheating zone:
- Temperature: 30ºC to 100ºC
- Speed: <3ºC / sec.
- Time: 25-90 seconds.
- The default time: 70 seconds.

Zone Settings wettability:
- Temperature: 100ºC to 130ºC
- Speed: 0,25-3ºC / sec.
- Time: 10-120 seconds.
- The default time: 45 seconds.

Soldering BGA:
- Temperature: 100ºC to 130ºC
- Speed: 0,12-1ºC / sec.
- Time: 30-240 seconds.
- The default time: 120 seconds.

Activation zone settings:
- Temperature: 130ºC to 179ºC
- Speed: 0,4-3ºC / sec.
- Time: 15 to 120 seconds.
- The default time: 65 seconds.

Parameters of the reflow zone:
- Temperature: 179ºC to 204-229ºC
- Speed: <3ºC / s
- Time: 30 to 110 seconds.
- The default time: 65 seconds.
- Peak temperature: 204-229ºC
- Melting begins at a temperature of 179ºC

Storage:
Store at + 4ºC to + 21ºC. Do not expose to freezing. The paste should be placed in room temperature for 4 hours prior to the time of use.