Splash Center (Code: )

A professional unit that integrates all important steps of PCB wet processing.

Spray etching compartment:

- Professional spray etching technology
- 100 µm line definition Etching speed with standard Fe-III-Cl: 35 µm Cu in 90s
- Max. board size 210 x 300 mm (Splash Center XL 300 x 400mm)
- Magnetic driven spray pump
- Built-in 1000 W heater
- Thermostat controlled
- Overheat protection
- Security lid switch
- Digital timer with count-down, auto-reset and beeper
- Also suitable for spray developing
- Special shadow-free PCB holder (titanium)
- Drop-off position for holder (see picture)

Four treatment tanks (from left to right side):

- Static pre rinse
- Static plus fresh water spray rinse (including magn. valve and foot-switch)
- Tank with basket and bath movement by pump, For resist stripping or developing
- Spare tank, i.e. for electroless tin

Features:

- All bathes covered by lids
- All bathes can be emptied by front integrated cog-valves
- Inclusive anti-pollution security tray

Technical Data:

- Power supply: 230 V~, 50 Hz approx. 1150 VA
- Dimensions (L x W x H): 100 x 67 x 121 cm (Splash Center XL  110 x 77 x 120cm)
- Tank capacity: 1 x 25 l + 3 x 7 l + 1 x 9 l  (Splash Center XL 1 x 40 l + 1 x 24 l + 3 x 15 l)
- Weight: 46kg (Splash Center XL  56kg)