FUZION - Flexible SMD mounting machines of the industrial class
For electronics manufacturers who demand an agile, flexible production model without limitations, Fuzion® is the pinnacle of platform performance. Fuzion is the industry’s most adaptable and capable platform, delivering profitable productivity for any manufacturing model from NPI to ultra-high volumes. Fuzion drives operational excellence, enabling manufacturers to build any product at any time, accelerate new product introduction and ramp to volume, and maximize utilization, quality, and yield.
- 1, 2, 4-beam variants
- Extra-capacity (XC) models with up to 272 feeder inputs
- Versatile multi-task odd-form (OF) model
- Throughput up to 140,000 cph per module
- Industry-leading cost per placement, flexibility and accuracy
- Largest board size capability
- Closed-loop processes to ensure the highest yields
- Maximum performance and utilization for any volume/product mix
- Comprehensive toolset to accelerate NPI and achieve 100% first-pass yield
- Ability to prototype on a single module
- Lowest cost of operation and ownership
Fuzion Models & Specifications
FuzionXC2-37 – High-capacity NPI, all-in-one, line balancer, or multifunction solution with a full component range
FuzionXC2-60 – Cost-efficient, high-performance turret replacement or high-input chip placer
Fuzion4-120 – Powerful performance for high-volume production environments: Consumer, Mobile, Notebook, Automotive
Fuzion2-37 – A true multi-purpose platform. A versatile stand-alone prototyping solution, a flexible line balancer, or a high-performance multi-function solution.
Fuzion2-60 – Flexible, high-speed productivity for medium-volume environments. A powerful line booster solution or high-performance small part placer.
Fuzion2-14 – Best-in-class multi-function machine with fast placement of a wide component range for applications where flexibility and performance per line length are important
Fuzion1-11 – Flexible IC placement platform perfect for NPI or complex SMT
| Model |
Max Throughput (cph) |
Accuracy (μm@>1.00 Cpk) |
Max Board Size |
Max Feeder Inputs (8mm) |
Component Range |
| Fuzion1-11 |
16,500 |
±38 (Chips) / ±27 (ICs) |
508 x 813mm |
120 (2 ULC) |
0201 – 150mm sq, 25mm tall |
| Fuzion2-14 |
30,750 |
±38 (Chips) / ±27 (ICs) |
508 x 813mm |
120 (2 ULC) |
0201 – 150mm sq, 25mm tall |
| Fuzion2-37 |
48,000 |
±34 (Chips) / ±27 (ICs) |
508 x 1016mm |
128 (1 ULC) |
01005 – 150mm sq, 25mm tall |
| Fuzion2-60 |
66,500 |
±34 (Chips) / ±34 (ICs) |
508 x 1016mm |
136 |
01005 – 30mm sq |
| FuzionXC2-37 |
43,000 |
±34 (Chips) / ±27 (ICs) |
610 x 1300mm |
272 |
01005 – 150mm sq, 25mm tall |
FuzionXC2-60
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65,500 |
±34 (Chips) / ±34 (ICs) |
610 x 1300mm |
264 |
01005 – 30mm sq |
| Fuzion4-120 |
140,000 |
±34 (Chips) / ±34 (ICs)
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500x700mm
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144 |
01005 – 30mm sq |
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Pick and Place Machine
- PCB size up to 1350mm x 500mm
- 272 feeder lanes plus direct tray feeder
- Component Range: 01005 to 150mm long x 25mm tall
- Speed: 0.14 seconds per placement
Capacity: 25,000 component placements per hour
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Universal Instruments’ Fuzion™ Platform is the revolutionary foundation of a contemporary production model that maximizes productivity while reducing costs for electronics manufacturers. Fuzion features more than twice the feeder capacity of traditional placement solutions to reduce changeover requirements and optimize utilization.
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- Powerful performance for high-volume production environments: Consumer, Mobile, Notebook, Auto
- Quad-beam, dual-drive overhead gantry system
- Four 30-spindle rotary FZ30 placement heads
- Dual on-the-head optics
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Flexible, high-speed productivity for medium-volume environments. A powerful line booster solution
or high-performance small part placer.
Dual-beam, dual-drive overhead gantry system
Two 30-spindle rotary FZ30 placement heads
Dual on-the-head optics
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- A true multi-purpose platform. A versatile stand-alone prototyping solution, a flexible line balancer, or a high-performance multi-function solution.
- Dual-beam, dual-drive overhead gantry system
- One 30-spindle rotary FZ30 and one 7-spindle FZ7 placement head
- Dual on-the-head optics and upward-looking vision system
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- Best-in-class multi-function machine with fast placement of a wide component range for applications where flexibility and performance per line length are important
- Dual-beam, dual-drive overhead gantry system
- Two 7-spindle FZ7 placement heads
- Upward-looking vision system
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- Versatile IC placement platform perfect for special processes such as Pin-in-Paste, Flip Chip and OFA
- Single-beam, dual-drive overhead gantry system
- One 7-spindle FZ7 and one 4-spindle FZ4 placement head
- Upward-looking vision system
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