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Products / Materials for the production and maintenance of electrical engineering / Solder paste for syringe application KESTER, EFD, HERAEUS, MULTICORE / Solder paste MULTICORE (HENKEL) /
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Multicore (Henkel) RP15 (Code: )

Multicore (Henkel) RP15
Multicore (Henkel) RP15
Multicore (Henkel) RP15
Solder paste, no-clean, RP15 is specially designed for application by manual or automatic dispensers. Solder paste RP15 has higher activity and adhesive properties, provides less spreading on pads after application.

Distinctive features:
- It has good adhesive properties
- Provides excellent wettability
- Has a non-corrosive flux residues that can not be removed after soldering
- RP15 provides improved solderability

Technical data:

1) The powdered solder: The most common is the alloy Sn62 / Pb36 / Ag2, the addition of silver increases the strength of the solder joint and prevents leaching of silver from the findings of the chip components. Solder paste RP15 comes with a particle size of 38 - 53 m or 25 - 38 microns. For optimal performance, the metal content in the paste by weight is 85%. Powdered solder to solder paste is produced by spraying RP15 alloys purity conforms QQ-S-571E, DIN1707, BS 219.

2) Flux: Flux, used as a solder paste RP15, is based on an artificial rosin with a high boiling point (275.S). Flux complies type IPC, LR3CN and Bellcore specifications.
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