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Products / Forming, assembling and soldering components / Reflow soldering /
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Product elucidation:
-The machine adopts heating method of imported heating board with even temperature and high heat compensation efficiency, is especially suitable for soldering of BGA CSP components;
-The patent wind wheel design can ensure wind speed wind speed can be adjusted by frequency conversion;


-The machine adopts heating method of imported heating board with even temperature and high heat compensation officiency is especially suitable for the soldering of BGA ,CSP components
-The patent wind wheel design, can ensure stable wind pressure


-Imported heating parts;Unifoerm temperature; High compensation rate;Suitable to welding CSP and BGA parts.
-Special,wind wheel design;Stable wind speeed
-Independent forced cycling for all heated places; Independent PID control; Up-down heating mode makes the temperature of the furnace cavity accurate and even with hig capacity.


- The machine adopts heating method of imported heating board, even temperature and heat compensation efficiency
- Special designed for small quantity and experiment, suitable for welding CSP and BGA parts;
- Heating mode adopts patent heating pipe, large heat capacity;



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