X33-12i (Code: )

NO CLEAN, RESIN-FREE, HALIDE-FREE, SUSTAIINED ACTIVITY FLUX

Multicore X33-12i is a no clean, resin free, halide free liquid flux for surfaces with poor solderability.

- Maximum process window and sustained activity – without resin
- High speed soldering on conventional leaded and SMD components – no bridges or icicles
- Good through hole penetration
- No cleaning – reduces costs
- Minimal residues to interfere with ATE probes without cleaning
- Compatible with rosin and OSP based surface preservatives
- Foam, spray or wave application

APPLICATIONS

Recommended for consumer electronics and general electrical soldering applications, particularly where high throughput is desirable.
This is a robust product. Its process window is greater than that of the recently launched X1248 and it should be favoured when there is additional demand for high performance/reliability.

TECHNICAL SPECIFICATION

A full description of test methods and detailed test results are available on request. The results below are typical: