SOLDERLAC (Code: )

SOLDERLAC has been developed especially to protect freshly etched printed circuit boards and to perform accurate, durable, nondamaging soldering work. Its constituents ensure long-lasting protection against oxidation as well as rapid soldering, preventing faulty dry solder joints. SOLDERLAC noticeably reduces the risk of overheating printed circuit boards and components owing to its good thermal conductivity. It also restores the soldering capability of corroded metallic surfaces.

Application
SOLDERLAC guarantees quick, reliable and exact soldering of all kind. It is particulary suited to soldering delicate components on printed circuit boards and the restoration of the soldering capability of corroded surfaces. SOLDERLAC is an effective protection against oxidation of PC boards intended for soldering. Complies with standard DIN 8511 FSW 31.

Directions
Surface to be treated has to be free of greases, oil, wax etc. Spray on the whole surface of parts to be treated, maintaining a distance of approximately 30 cm, otherwise the layer applied will flow. The laquer will be dry to permit handling after 25 min, and fully curred after approx. 24 hours. The spray nozzle has a self-cleaning action. Should it nevertheless get clogged, clean it using alcohol.