LPL 16933/95 Solder Paste (Code: )

No-Clean Solder Paste for Dispensing

Description

LPL16933/95 is a ready-to-use homogeneous mixture, consisting of metal powder, binder, solvent, flux and thixotropic agent. Although this paste is optimized for dispensing application, it has a very low slump. LPL16933/95 provides a very good wettability and leaves clear flux residues. It does not contain any halogen or halogenated activators. LPL16901/94 (the same paste just with c. 90 % metal) has passed all tests for no clean solder pastes according to Siemens-standard SN 59650 (issue July 1994). Due to its limited tack time this solder paste is suitable only for the in-line production.

Typical Properties

Metal powder shape: Alloy: Melting Point: Particle Size: Metal %: Viscosity:
spherical Sn62/Pb36/Ag2 179 °C 25 -75 µm 87 % 200 -500 Pa ss

Organic vehicle
If the paste is properly stored, its composition prevents crusting and ensures the following rheological properties:
- excellent dispensability
- stable viscosity.

Flux activity
According to:
- ANSI-J-STD-004: LO
- ISO 9454-1: 1.1.3.C.
- IPC-SF-818: Type LR3N

Cleaning
The flux residues don't need to be cleaned. They may remain on the circuit.

Processing
- Ensure that the paste has reached room temperature before opening, to prevent condensation.
- Stir well prior to use.

Dispensing data
Nozzle diameter:
depending on the nozzle-shapedown to c. 0.5 mm (cone-shaped nozzle preferred).

Clean wet paste:
with diverse Zestron und Vigon cleaning materials, see separate application recommendations.
- The peak temperature depends on the heat capacity of the components.
- Reflow can be done under air or an inert atmosphere.