Пример
Написать
письмо
Automatisierungs- und Montagetechnik Horbal
DeutschRussianEnglish

Assembly Lines | Heat-Cutters | Stationary screwdriving Systems


Home
Products
Deliveries of the equipment under catalogs from Germany Deliveries of the equipment under catalogs from Germany
Special offers
Contacts
Impressum
Methods of payment and delivery
Products / Materials for the production and maintenance of electrical engineering / Solder paste for screen printing KESTER, HERAEUS, MULTICORE / Solder paste HERAEUS /
Webdesign

Solder Pastes F360 Series (Code: )

 Solder Pastes F360 Series

No Clean Solder Paste

Description:

F360 Series solder pastes are ready to use homogenous mixtures, consisting of fully alloyed metal powders, binders, solvents and thixotropic agents for surface mount assembly applications. These pastes provide excellent wetting and are capable of printing down to 12 mil pitch. F360 Series pastes are available for every application. They can be reflowed in air or N2 and the residues may be left on the board.

Key Benefits:
- Passes Bellcore requirements for no clean solder pastes per TR-NWT-000078 issue 3
- Passes IPC requirements for class 3 no clean pastes per IPC-SF-818.
- Long tack and work life
- Excellent wetting
- Capable of printing 12 mil. pitch
- Low residue

Recommended Processing Guidelines:

Cleaning:

The flux residues may remain on the circuit. They do not need to be cleaned.

If cleaning is required, the residues may be cleaned in any available solvent such as: freon, semiaqueous and aqueous with a saponifier (saponifier concentration ~.59%, water temperature 60 – 65oC).

Clean wet paste with isopropanol or similar solvents.

If the printing interval exceeds 1 hour, remove the paste from the stencil.

The printed solder paste remains tacky for up to 16 hours to allow device insertion. The exact time depends on environmental conditions.
If the printed circuit boards will be stored for more than 8 hours after populating and prior to reflow, it is advisable to store the boards in a tightly closed area. This is especially important if the humidity exceeds 65%. Humidity should ideally be controlled between 45 - 65%.

Reflow Parameters:
For optimum results the paste should be reflowed at 25-50oC above the liquidus temperature of the alloy. Time above liquidus should be maintained for 20 - 60 seconds. Heating should be uniform across the substrate and components. Reflow can be accomplished with any industry accepted process.

Packaging:
Pastes are available in 250, 500 and 1000gm. jars 5, 10 and 30cc. syringes 3, 6 and 12oz. cartridges

Storage:
Store in a dry location at 10-25oC. Avoid direct sunlight. Allow paste to come to room temperature prior to opening. Store syringes vertically, tip down.

Safety:
When using do not eat, drink or smoke. Avoid contact with skin and eyes. Wear suitable gloves and eye protection. Contains lead!

Warranty:
Material guaranteed to meet specifications for 6 months from date of shipment.



Home . Products . Deliveries of the equipment under catalogs from Germany . Special offer . Contacts