Solder paste HERAEUS

Description:

F10 Series solder paste is a ready to use homogenous mixture, consisting of fully alloyed metal powders, binders, solvents and thixotropic agents for surface mount assembly applications. This paste provides excellent wetting. F10 Series is available for every application. It can be reflowed in air or N2 and feature an ultra low odor level. The printing capabilities of these pastes are unsurpassed. The residues may be left on the board. F10B is Bellcore (Telecordia) complaint.

Heraeus offers a full line of no clean, solvent clean, and water soluble solder pastes for surface mount and semiconductor applications. Sn/Pb and Sn/Pb/Ag alloys are available in melting points from 179 °C to 312 °C. These pastes are compatible with a variety of reflow methods including convection, vapor phase, and vacuum systems. Solder pastes are available in particle sizes ranging from Type 3 to Type 8 powders for standard and ultrafine printing requirements.

Water-Soluble

Description:

F541 Series solder pastes are ready to use homogenous mixtures consisting of fully alloyed metal powders, binders and solvents for surface mount assembly applications. F541 is a state of the art formulation that features robust OA activity for unparalleled solderability. The sophisticated flux activation system provides excellent wetting and minimal void formation on a variety of substrates. The flux composition is completely water-soluble so that all residues are removed after cleaning in deionized water.

No Clean Solder Paste

Description:

F360 Series solder pastes are ready to use homogenous mixtures, consisting of fully alloyed metal powders, binders, solvents and thixotropic agents for surface mount assembly applications. These pastes provide excellent wetting and are capable of printing down to 12 mil pitch. F360 Series pastes are available for every application. They can be reflowed in air or N2 and the residues may be left on the board.