HERAEUS F-10 Solder Pastes (Code: )

Description:

F10 Series solder paste is a ready to use homogenous mixture, consisting of fully alloyed metal powders, binders, solvents and thixotropic agents for surface mount assembly applications.  This paste provides excellent wetting.  F10 Series is available for every application.  It can be reflowed in air or N2 and feature an ultra low odor level.  The printing capabilities of these pastes are unsurpassed.  The residues may be left on the board.  F10B is Bellcore (Telecordia) complaint.

Key Benefits:
- Exceptional print to print consistency

- Excellent wetting

- Low odor

- Passes IPC requirements for class 3 no clean pastes per IPC-SF-818

- 8 hour tack and work life

Reflow Parameters:
For optimum results, the paste should be reflowed at a peak temperature of 30-50°C above the liquidous temperature of the alloy.  Time above liquidous should be maintained for 30-60 seconds.  Heating should be  uniform across the substrate and components.  Reflow can be accomplished with any industry accepted process.

Packaging:
Available in 250, 500 and 1000 gram jars 6 ounce and 12 ounce cartridges

Storage:
Store in refrigeration at 5-12°C.  Avoid direct sunlight and temperatures exceeding 35°C.  Allow paste to come to room temperature for a minimum of 2 hours prior to opening.  Store syringes and cartridges vertically with the tips down.

Safety:
When using do not eat, drink or smoke.
Avoid contact with skin and eyes.
Wear suitable gloves and eye protection.
Contains lead!

Warranty:
Material guaranteed to meet specifications for 6 months from date of shipment.