Solder Pastes F541 (Code: )

Water-Soluble

Description:

F541 Series solder pastes are ready to use homogenous mixtures consisting of fully alloyed metal powders, binders and solvents for surface mount assembly applications. F541 is a state of the art formulation that features robust OA activity for unparalleled solderability.  The sophisticated flux activation system provides excellent wetting and minimal void formation on a variety of substrates.  The flux composition is completely water-soluble so that all residues are removed after cleaning in deionized water.

This unique formula is specially designed to give excellent results in Pb-free applications.  F541 provides excellent wetting and void-free performance with the Sn/Ag/Cu alloy system.  This paste is capable of printing .012” pitch at speeds up to 6”/second.  F541 features long stencil life and exhibits excellent first print after wait performance.

Key Benefits:

- Capable of printing .012” pitch

- Excellent wetting (Sn/Pb and Pb-free)

- 8-hour stencil life

- Resistant to hot and humid slump

- Long tack life

- High-speed print capability