Пример
Написать
письмо
Automatisierungs- und Montagetechnik Horbal
DeutschRussianEnglish

Assembly Lines | Heat-Cutters | Stationary screwdriving Systems


Home
Products
Deliveries of the equipment under catalogs from Germany Deliveries of the equipment under catalogs from Germany
Special offers
Contacts
Impressum
Methods of payment and delivery
Products / Materials for the production and maintenance of electrical engineering / Solder paste for screen printing KESTER, HERAEUS, MULTICORE / Solder paste HERAEUS /
Webdesign

Solder Pastes F541 (Code: )

Solder Pastes F541

Water-Soluble

Description:

F541 Series solder pastes are ready to use homogenous mixtures consisting of fully alloyed metal powders, binders and solvents for surface mount assembly applications. F541 is a state of the art formulation that features robust OA activity for unparalleled solderability.  The sophisticated flux activation system provides excellent wetting and minimal void formation on a variety of substrates.  The flux composition is completely water-soluble so that all residues are removed after cleaning in deionized water.

This unique formula is specially designed to give excellent results in Pb-free applications.  F541 provides excellent wetting and void-free performance with the Sn/Ag/Cu alloy system.  This paste is capable of printing .012” pitch at speeds up to 6”/second.  F541 features long stencil life and exhibits excellent first print after wait performance.

Key Benefits:

- Capable of printing .012” pitch

- Excellent wetting (Sn/Pb and Pb-free)

- 8-hour stencil life

- Resistant to hot and humid slump

- Long tack life

- High-speed print capability

Printing +
Dispensing +
J-STD-004 classification    
H1
Reflow in air +
Reflow in nitrogen +
Vapour phase +
Superior wetting +
Very clear flux residues n/a
Easy cleaning with water +


Home . Products . Deliveries of the equipment under catalogs from Germany . Special offer . Contacts