HydroMark 531 (Code: )

HydroMark 531 Water-Soluble Solder Paste

Product Description

Kester HydroMark 531 is an organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, HM531 provides hours of stable stencil life, tack time and repeatable brick definition. HM531’s robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed.  The activator package in the HM531 is very aggressive and provides superior wetting to OSP-coated PCB’s and Ag/Pd components.

The outstanding batch consistency, anti-slump chemistry, consistent print volumes, solderability and cleanability make the HM531 an ideal water-soluble solder paste for any application.

-  HM531 provides outstanding batch-to-batch consistency
-  Excellent anti-slump characteristics minimizing bridging defects
-  Capable of 60+ minute idle times in printing
-  Capable of print speeds up to 150mm/sec (6in/sec)
-  Excellent solderability to a wide variety of metallizations, including Palladium, leaving bright, shiny joints
-  Residues easily removed with hot DI water, even up to 48 hours after soldering
-  Minimal foam in wash systems
-  8+ hour stencil life
-  Classified as ORM0 per J-STD-004
-  Produces minimal voiding underneath BGA components
- Compatible with enclosed print head systems

Standard Applications
90% Metal – Stencil Printing
90% Metal – Enclosed Head Printing