LF318 Solder Paste (Code: )

PIN-TESTABLE LEAD-FREE SOLDER PASTE

PRODUCT DESCRIPTION

Multicore LF318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing. LF318 solder paste offers a high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP Copper.

FEATURES AND BENEFITS

- Outstanding humidity resistance – gives excellent coalescence even after 72 hours exposure to 27ºC/80% RH, thus reducing process variation due to environmental factors

- Colourless residues for easy post-reflow inspection

- Soft non-stick pin testable residues allow easy in-circuit testing

- Suitable for fine pitch, high speed printing up to 150mm/s (6”/s)

- Extended open time & tack-life leading to low wastage.

- Halide free flux classification: ROL0 to ANSI/J-STD-004

TYPICAL PROPERTIES
Based upon type 3 powder; other sizes also available

(1) Measured at 25°C, TF spindle at 5rpm after 2 minutes
(2) Measured at 25°C, and a shear rate of 6s-1
(3) TI = log (viscosity at 1.8s-1/Viscosity at18s-1)
(4) Slump data are expressed as the minimum spacing between pads of the size shown that does not allow bridging
(5) Tack data are derived from comparative laboratory tests and do not necessarily relate directly to a particular user’s conditions