Solder paste MULTICORE (HENKEL)

PIN-TESTABLE HUMIDITY RESISTANT SOLDER PASTE
PRODUCT DESCRIPTION

MulticoreŁ MP218 solder paste is a halide-free, no clean, pin testable solder paste which has excellent humidity resistance and a broad process window, both for reflow and printing. MP218 solder paste offers a high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including HASL, Ni/Au, Immersion Sn, Immersion Ag and OSP Copper.

NO CLEAN RMA SOLDER CREAMS

Multicore RM92 solder creams have been formulated as No Clean RMA type products showing superior resistance to preheat slump during reflow processes.

- Screen printing and stencilling grades available
- Grades suitable for fine pitch applications available
- Excellent resistance to preheat slump
- Good tack performance and wetting
- Residues may be left uncleaned

CR36 No-Clean Solder Paste Highest Activity Offering

DESCRIPTION/APPLICATION

A high activity, colorless residue, no-clean solder paste. CR36 exhibits good abandon time, long stencil life, and minimal hot slump. It has excellent wetting to a wide range of surface finishes. The activity of CR36 gives it an exceptional reflow process window, making it suitable for both volume and high mix manufacturing.

PIN-TESTABLE LEAD-FREE SOLDER PASTE

PRODUCT DESCRIPTION

Multicore LF318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing. LF318 solder paste offers a high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP Copper.

HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE

PRODUCT DESCRIPTION

Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased reflow process window.

-Suitable for fine pitch, high speed printing up to 200mms-1.

- Extended printer open time and tack-life.

- Prolonged between print abandon time.

WATER-WASHABLE SOLDER PASTE

PRODUCT DESCRIPTION

Multicore WS200 solder paste is a water washable product for printing and reflow in air or nitrogen atmospheres where process yield is critical. It offers excellent open time, and good soldering activity over a wide range of reflow profiles and surface finishes. Multicore WS200 solder paste is available with Sn62 & Sn63 alloys. Other alloys may be available on request.