MP218 Solder Paste (Code: )

PIN-TESTABLE HUMIDITY RESISTANT SOLDER PASTE
PRODUCT DESCRIPTION

MulticoreŁ MP218 solder paste is a halide-free, no clean, pin testable solder paste which has excellent humidity resistance and a broad process window, both for reflow and printing. MP218 solder paste offers a high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including HASL, Ni/Au, Immersion Sn, Immersion Ag and OSP Copper.

FEATURES AND BENEFITS
- Outstanding humidity resistance – gives excellent coalescence even after 24 hours exposure to 75%RH, thus reducing process variation due to environmental factors
- Colourless residues for easy post-reflow inspection
- Soft non-stick pin testable residues allow easy in-circuit testing
- Suitable for fine pitch, high speed printing up to 150mm/s (6”/s)
- Extended open time & tack-life leading to low wastage.
- Halide free flux classification: ROL0 to ANSI/J-STD-004

TYPICAL PROPERTIES
Based upon type 3 powder; other sizes also available