WS200 Solder Paste (Code: )

WATER-WASHABLE SOLDER PASTE

PRODUCT DESCRIPTION

Multicore WS200 solder paste is a water washable product for printing and reflow in air or nitrogen atmospheres where process yield is critical.  It offers excellent open time, and good soldering activity over a wide range of reflow profiles and surface finishes.  Multicore WS200 solder paste is available with Sn62 & Sn63 alloys. Other alloys may be available on request.

FEATURES AND BENEFITS
- Effective over a wide range of printer cycle times and print speeds
- Excellent printer open time and between print abandon time  
- Long component tack time
- Excellent slump resistance
- Effective over a wide range of reflow profiles in air or nitrogen
- Residues removed with deionised water rinse TYPICAL PROPERTIES

1.Measured at 25°C, TF spindle at 5 rpm after 2 minutes. 2.Measured at 25°C 3.Log (viscosity at 1.8s-1/viscosity at 18s-1)
4.The slump data are expressed as the minimum spacing between pads of size shown that does not bridge.
5.Tack data are derived from laboratory tests, and do not necessarily relate to particular user conditions.